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Top » Catalog » PC Hardware Parts » CPU Cooler » TPC 612 » Cooler Master TPC 612 CPU Cooler
[TPC 612]
  Vertical Vapor Chamber Technology  
  The first-ever CPU heatsink to use vertical vapor chamber technology. The heat from CPU hot spots gets spread and faster transferred to the fins resulting in improved efficiency.  
  Synergy Cooling of 2 Technologies  
  The TPC 612 uses 2 separate cooling technologies to transfer heat – heat pipes and vertical vapor chambers, substantially allowing much improved cooling performance.  
  Special Fin Design
  Fan being special design to concentrate the cold air to heatsink area.  
  100% Pure Polished Copper Base with improved Soldering Technologies  
  The source of innovations is inside of details, based on this rules we optimize the base, fins and soldering.  
  Improved Air Pressure Design and
Fan Mounting System
  Adopt the powerful PWM fan for improved airflow and air pressure; the quick snap fan bracket improve to mount a fan  
  Supports all Intel and AMD platforms including LGA 2011 and FM1  
  The socket mounting system supports all sockets, even high-end system like LGA 2011, providing the best pressure for optimized cooling performance.  
Vertical Vapor Chamber
Vertical Vapor Chambers feature less than half the air resistance by reducing airflow vortexes and noise generated by air streaming through a heat sink. At the same time vertical vapor chambers exhibit 3 times the fin contact area, enabling faster and more efficient transfer of heat from the vapor chambers to the fins, and overall more efficient use of the available fin surface area.
Technical Diagram


For more information, please visit this products webpage.
This product was added to our catalog on Sunday 09 March, 2014.